Moduleworks Germany: CAM experts meet at Insider Conference

Editor: Briggette Jaya

Germany-based software component provider for the CAD/CAM industry, Moduleworks, has just held its Insider Conference attracting some 70 experts from CAM companies.

Among the experts at the forum were keynote guest speakers from Siemens PLM Software, Huron Graffenstaden and Sandvik Coromant.
Among the experts at the forum were keynote guest speakers from Siemens PLM Software, Huron Graffenstaden and Sandvik Coromant.
(Source: Moduleworks)

The Moduleworks Insider Conference (MIC 2018) held last week at the Tivoli Stadium, Aachen, Germany, provides a platform for industry experts to meet, network, exchange knowledge and ideas, and forge stronger working relationships to accelerate the future development of the technology.

Among the 70 experts at the forum were keynote guest speakers from Siemens PLM Software, Huron Graffenstaden and Sandvik Coromant. According to Moduleworks, the key speakers provided new insights for agile development processes and job set-up data benefits.

The dinner event at MIC 2018 had participants continuing discussions in a relaxed and informal atmosphere.
The dinner event at MIC 2018 had participants continuing discussions in a relaxed and informal atmosphere.
(Source: Moduleworks)

They showed how tool designs and CAM algorithms need to work together. Apart from the presentations, specialised workshops were organised to enable participants to get in-depth proficiency on topics such as 3 and 5-axis machining and simulation, with a special session covering research projects and bespoke developments.

A lab area demonstrated the wider potential of the technology and showed how the Moduleworks toolpath and simulation software can benefit industries beyond the classical CAD/CAM and CNC markets.

Moduleworks MD Yavuz Murtezaoglu said: “Building strong business relationships and working in close collaboration on software integration projects are the key to getting the best possible benefits from the synergies of different technologies.”

This article was first published on www.etmm-online.com.

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