Under the heading Heitec 4.0, Heitec has developed a portfolio of solutions ranging from digital installations or process planning to virtual commissioning or monitoring of installation and production processes.
The solution portfolio supports the construction of an intelligent factory with adaptive machines and installations, we hear. With the digital framework Hei-VM, which uses object orientation (functional model building) and has access to Heitec’s building-block library, large cost-saving are achieved, even in special machine construction, by first carrying out commissioning on a virtual model and removing all faults, which makes on-site commissioning of installation fast and straightforward. This improves the quality of the software noticeably and reduces throughput times in development and commissioning.
Meanwhile, Hei-VM has become established as a digital twin not only in new developments, but also in retrofit projects. Using Hei-TPM to access supplementary data from real production, the digital machine can also be used for training purposes or for optimising already existing installations.
Hei-TPM (Total Productive Manufacturing) extends digitisation down to shop-floor level and, according to Heitec, can be integrated quickly into various IT landscapes. Connections are made via manufacturer-independent platform such as Acron, SAP or diverse Cloud solutions.
On the basis of existing expertise in industrial IT solutions and using current SEP technologies, Heisab, the SAP consulting firm in the Heitec Group, uses Hei-TPM to integrate all the customer’s product-related data and processes into the value creation chain represented in SAP ERP, from planning to production control. The result is improved connectivity, said to enable fast realisation of optimisation potentials in all areas of production and logistics.
More precise planning and optimised material flow
Since all data is collected, pre-processed and transferred in real time, production managers can plan downstream processes and retoolings more precisely and optimise resources and material flow, we hear. Particular future security and good performance in communications is available with the manufacturer-independent access procedure OPC UA based on Time Sensitive Networkings (TSN).
Visit Heitec AG at Hannover Messe in Hall 5, Booth D10.